Semiconductor Engineering's Inside Chips

John Kibarian, CEO of PDF Solutions, talks with Semiconductor Engineering's Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly.

AI is everywhere, and it includes a lot of data that needs to be processed, moved, stored, and retrieved. That takes a lot of energy, and it creates a whole bunch of problems that need to be addressed throughout a chip's lifecycle.

Everything starts with AI — stacked die and chiplets, digital twins, and looming job market changes.

News and insights from imec ITF World 2025, including a one-on-one interview with imec's chief strategy officer on system technology co-optimization with AI.